Patrick Nolan, President of DDL and Rick Roberti, Lab Manager for DDL East will both be attending the ISTA Transport Packaging Forum this week in Orlando, Florida. The Transport Packaging Forum is one of the premier events in the transport packaging industry. For those of us in the medical device industry, it is crucial to understand how the physical distribution and transportation of your products can affect the end user. Product integrity can often be compromised during the transportation stage of product distribution, often due to a lack of temperature monitoring solutions, temperature control, poor package design or non-compliance with packaging industry standards.

Some of the featured speakers at this year’s show for those of you concerned with package and product integrity topics will include:
- Ed Church, Executive Director, ISTA and Brian Wallin, Engineer, Amgen – ISTA Standards for Temperature-Controlled-Products
- Greg Batt, Lecturer, Clemson University – Use of Simultaneous Three Axis Vibration in Simulation of the Transport Environment
- Dale Root, Lansmont Corporation – Constructed Probability, Applying Analysis Results in the Lab in Pursuit of Improved Damage Correlation
- Dr. S. Paul Singh, Professor, Michigan State University School of Packaging – Handling of Sea Containers in International Ports
Events like the Transport Packaging Forum are extremely valuable to packaging professionals that work in the medical device, pharmaceutical, life science and bio-tech industries, to ensure that we are continually learning from our peers. Staying up to date on the ever changing world of packaging can ultimately affect how both the package integrity and product integrity of these life saving, valuable products is treated.
How do changes in the transport packaging industry affect how your products need to be handled before reaching the end user?