Saturday, 19 of May of 2012

Category » Trade Show Events

DDL Packaging Engineer Scott Levy is co-chairing the Medical Packaging Update at MD&M Minneapolis

DDL, Inc. will be exhibiting at the 2011 MD&M Minneapolis Expo & Conference next month in the Twin Cities. The show kicks off with the conference on November 1st at the Minneapolis Convention Center.

MD&M Minneapolis’ Expo hall maximizes your time by gathering the world’s best and most qualified suppliers under one roof. They know your industry, understand your objectives, and are ready to help you bring that new device to market and accelerate your project’s completion

DDL’s Lead Packaging Engineer Scott Levy is a co-chair of the Medical Device Packaging Update at the conference on Thursday, November 3rd. We invite you to join Scott, along with co-chair Kevin Zacharias of Oliver-Tolas Healthcare Packaging for an update on happenings in the medical device packaging industry.

DDL will be exhibiting at booth #830 during the expo, where you will have an opportunity to talk to Scott Levy about any current and upcoming package testing projects.

We look forward to seeing you at this year’s show. If you have any questions regarding your package testing needs, please contact us, we are happy to help answer your questions.


Join DDL at the Sustainable Packaging Forum, Sep. 20-22 in Dallas

DDL President, Patrick Nolan will be representing us at this year’s Packaging Strategies’ Sustainable Packaging Forum, September 20-22 in Dallas, Texas.

DDL’s newly developed Responsible Packaging Development Group, led by Mr. Nolan is attending this year’s Sustainable Packaging Forum to meet with executives and people within companies that are implementing sustainable packaging initiatives in their organization.

Sustainable Packaging Forum, Dallas Texas

A number of companies understand the importance of designing sustainable packaging; however, many fail to consider the potential unintended consequences that could arise if the package is not tested to ensure the environment it is exposed to is allowing the new package design to effectively protect the product. Our experience with distribution simulation testing will help ensure that you’re new sustainable package is still protecting the product as originally intended.

We look forward to seeing anyone that may be attending this year’s show. If you want to learn more about the Sustainable Packaging Forum and register to attend, click below for further details about the forum and to register.

Sustainable Packaging Forum, DDL


DDL will be attending the 2011 ISTA International Transport Packaging Forum

DDL President, Patrick Nolan and DDL East Lab Manager, Rick Roberti will be attending next week’s ISTA International Transport Packaging Forum in Orlando, Florida.

2011 ISTA International Transport Packaging Forum, DDL Inc., transport packaging, testing

ISTA’s International Transport Packaging Forum
is the most well attended educational event providing the latest ideas and advancements of sustainable transport packaging and the physical distribution of products. The international educational and networking advantages are superior! The Forum will provide you with quality presentations and valuable case studies from world-leading experts along with opportunities to interact with industry peers to discuss critical issues, share solutions, gain ideas and ultimately become a more knowledgeable packaging professional.

Will you be attending this year’s  Transport Packaging Forum and what are you hoping to get out of it?


DDL Exhibiting at LifeScience Alley Conference & Expo in Minneapolis

DDL will be exhibiting next week at the LifeScience Alley Conference & Expo at the Minneapolis Convention Center. Feel free to stop by and say hello to us at booth #706.

LifeScience Alley Conference & Expo, DDL, package testing, product testing, life sciences

Who Should Attend?

The LifeScience Alley® annual conference brings together global leaders in the life science and health care industry to identify trends, share expertise, and network across disciplines. The goal of this gobal conference is to equip attendees with information and resources that will help them stay ahead of the “Health
Tomorrow” curve. This is a place where science and business converge to uncover hidden challenges and identify new areas of opportunity.
(LifeScience Alley)

LifeScience Alley presents an opportunity to meet and connect with life science industry leaders and to attend one of the many seminars or keynote presentations that will discuss current trends and innovations in the life science industry.

The event is next Wednesday, December 8th starting at 8:00 am with a Breakfast General Session.

Click here to register for LifeScience Alley.

Hopefully we will see many of you at the show next week, it should be a great day to bring together many businesses that help support, innovate and grow the life science industries.


PACK EXPO International 2010

Cryopak and DDL will be exhibiting at next week’s PACK EXPO International show in Chicago, IL. If you are attending the show and want to learn more about the work that we do to support pharmaceutical, medical device, biotech, food and consumer product companies with thermal package design, cold chain packaging solutions and packaging testing, make sure to stop by booth #6914 to say hello to one of our packaging engineers.

Pack Expo, Cryopak, DDL, packaging testing, thermal packaging
More than 1,600 exhibiting companies will be on hand in Chicago to showcase their latest packaging technologies on more than 1.1 million net square feet of space. Attendees will find state-of-the-art advances in packaging and processing equipment, converting machinery, materials, packages and containers and components.

Click here to register for PACK EXPO

We look forward to seeing everyone that will be able to attend the show next week! If you have any questions on upcoming cold chain packaging or package testing projects, we would be happy to help.


Transport Packaging Forum 2010: Orlando, Florida

Patrick Nolan, President of DDL and Rick Roberti, Lab Manager for DDL East will both be attending the ISTA Transport Packaging Forum this week in Orlando, Florida. The Transport Packaging Forum is one of the premier events in the transport packaging industry. For those of us in the medical device industry, it is crucial to understand how the physical distribution and transportation of your products can affect the end user. Product integrity can often be compromised during the transportation stage of product distribution, often due to a lack of temperature monitoring solutions, temperature control, poor package design or non-compliance with packaging industry standards.

Transport Packaging Forum, ISTA, Distribution, Transportation, medical device, pharmaceutical, DDL

Some of the featured speakers at this year’s show for those of you concerned with package and product integrity topics will  include:

  • Ed Church, Executive Director, ISTA and Brian Wallin, Engineer, Amgen – ISTA Standards for Temperature-Controlled-Products
  • Greg Batt, Lecturer, Clemson University – Use of Simultaneous Three Axis Vibration in Simulation of the Transport Environment
  • Dale Root, Lansmont Corporation – Constructed Probability, Applying Analysis Results in the Lab in Pursuit of Improved Damage Correlation
  • Dr. S. Paul Singh, Professor, Michigan State University School of Packaging – Handling of Sea Containers in International Ports

Events like the Transport Packaging Forum are extremely valuable to packaging professionals that work in the medical device, pharmaceutical, life science and bio-tech industries, to ensure that we are continually learning from our peers.  Staying up to date on the ever changing world of packaging can ultimately affect how both the package integrity and  product integrity of these life saving, valuable products is treated.

How do changes in the transport packaging industry affect how your products need to be handled before reaching the end user?


MD&M Minneapolis 2009

DDL had a great time last week at the MD&M Minneapolis show at the Minneapolis Convention Center, which showcased companies as resources in the  medical product development and manufacturing process. We were able to see many clients and meet a lot of new faces, all in all, it was a good trade show.

Scott Levy, one of our Packaging Engineer’s  spoke in front of a full house as part of the conference on Thursday, the topic of Scott’s presentation was Distribution Simulation Testing.

MD&M Minneapolis, Medical Device Manufacturing, DDL, Medical Device Package Testing

There were many medical device manufacturers that attended and exhibitors included companies in toxicology, biotech, pharma, mid-pack and medical device.

If you missed us at MD&M Minneapolis, we will be at BIOMEDevice in San Jose at the beginning of December, or you can connect with us before then by contacting us.


Pack Expo 2009

Here is a glimpse of the TCP Reliable and DDL booth from last week’s Pack Expo 2009 trade show in Las Vegas, Nevada. Scott Levy and Lyndsey Danberry from DDL, David Whitt from TCP and Raj Gill from Cryopak were all there to handle the busy yearly conference.

There was a very diverse crowd of attendees; ranging from food manufacturers looking for temperature controlled packaging solutions for shipping, to pharmaceutical folks looking for cooling solutions  to streamline turnaround on time sensitive products. The biggest names in package testing and package design were all there to show off their products and services, as well as enjoy some time in Sin City.

Did you attend Pack Expo 2009?

TCP Reliable, DDL and Cryopak at Pack Expo 2009

DDL - Pack Expo 2009


DDL at PACK EXPO Las Vegas Next Week, Oct. 5-7

We just wanted to let everyone know that DDL will be at PACK EXPO 2009 next week in Las Vegas, Nevada. The event opens up on Monday the 5th and ends on Wednesday the 7th. If you are attending the event, make sure to stop by our booth and meet Scott Levy and Lyndsey Danberry, as well as learn more about what we do at DDL.

Las Vegas strip at night 2

We will be one of more than 1,200 companies to showcase the latest developments in packaging technology and state-of-the-art advances in packaging machinery, converting machinery, materials, packages and containers, and components.

Of course, if you have any questions about medical device package testing or other technical packaging questions, we will be happy to answer them for you.

Will you be attending PACK EXPO 2009 in Las Vegas?